CoolShield-Flex is a stack-up film of thermal interface materials (TIM), metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics.
Features and Benefits
Efficient thermal path
Good shielding effectiveness
Ease of assembly with thermal interface material applied both sides
Can survive reflow
flexible film allows for PCB component height tolerance during assembly