TpcmTM 580SP is an exceptionally high performance, screen printable or stencilable thermal interface material designed to meet the thermal reliability and price requirements of high-end thermal applications. It contains a solvent to assist in processing. After drying off the solvent, Tpcm 580SP will be dry to the touch. Tpcm 580SP begins to soften and flow at temperatures around 50deg C. At which point, Tpcm 580SP will fill the microscopic irregularities of the components it contacts. The result is an interface with minimal contact thermal resistance. Tpcm 580SP softens; it does not fully change state, resulting in minimal migration (pump out) under thermal cycling from room temperature to chip device operating temperatures.
Features and Benefits
Low total thermal resistance
Inherently tacky and easy to use, no adhesive required