Tpcm 780 is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of todays demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount. Also, since no tabs are required, Tpcm 780 eliminates the need for expensive converting.
Features and Benefits
Silicone-free for applications that are silicone sensitive
Outstanding thermal performance helps to ensure CPU/application reliability
No mess due to thixotropic characteristics which prevent flow outside of interface