Tpcm 780SP is a high performance, inherently tacky, easy to rework screen printable phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today'ss demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount.
Features and Benefits
Silicone-free for applications that are silicone sensitive Low total thermal resistance
Inherently tacky and easy to use, no adhesive required
High thermal reliability
Ease of use for high volume manufacturing
No mess due to thixotropic characteristics which prevent flow outside of interface